Sputtering Targets
Based on the application, several options are available. Mitsubishi Materials can
supply sputtering targets for the following applications: LSI, Magnetic Disk and
Head, Magneto-Optical Disk, Optical Disk, Superconducting Thin Film, Protective Film and
Precious Metal.
| Application |
Comments
|
| Large Scale Integration |
Types = Al,
Mo, W, Mo-Si, W-Si, Ti-Si, Ti, Ti-W, TiN all with 5N purity |
| Magnetic Disk & Head |
Types = Co-Cr,
Co-Ni, Ni-Fe, Permalloy, Supermalloy all with 3N purity; Cr with 2N8/3N5/4N5 purity;
Co-Ta-Zr,Co-Nb-Zr (±5% of each composition); Sendust (Fe-Al-Si) with any composition. |
| Magneto-Optical Disk |
Types = Tb-Fe,
Tb-Fe-Co, Tb-Gd-Fe-Co, Nd-Dy-Fe-Co with negotiable composition |
| Optical Disk |
Types = Te, Se, Sb,
Te Alloy, Se Alloy, Sb Alloy, In-Alloy with negotiable composition ... more than 100
different compositions produced. Alloy elements are controlled within ±0.5%. |
| Superconducting Thin Film
|
Types = La-Sr-Cu-O,
Y-Ba-Cu-O, Bi-Sr-Ca-Cu-O; 3N purity; any composition is available |
| Protective Film |
Types = SiO2 (5N
purity) and Sialon (Si-Al-O-N) |
| Precious Metal |
Types = Au
(3N/4N/5N purity); Au-Si, Au-Ge, Au-Sn (4N purity) any composition available; Ag, Pd, Pt
(3N/4N purity) |
Information posted for referende only. Please
contact us if you have questions or need additional information.
|
